The National University of Singapore (NUS) is seeking a Research Fellow in the Department of Electrical and Computer Engineering, College of Design and Engineering. This postdoctoral research position focuses on developing analytical and equivalent-circuit models for next-generation advanced packaging and high-density interconnects, including 2.5D/3D integration, hybrid bonding, nano-through-silicon vias, backside power delivery networks, and co-packaged optics. Applicants should hold a Ph.D. in a relevant discipline and have expertise in electrical modeling, circuit simulation, and interconnect performance analysis.
Important Dates / Deadline
- Job Posted: November 2, 2026
- Application Deadline: November 23, 2026 (standardized deadline set 15 calendar days after the current date because the source does not specify an application deadline).
Organization
- Institution: National University of Singapore (NUS)
- College: College of Design and Engineering
- Department: Electrical and Computer Engineering (ECE)
- Position: Research Fellow
- Employee Category: Research Staff
- Principal Investigator: Prof. Yu Chen-Hua
Location / Study Destination
Singapore, Kent Ridge Campus, National University of Singapore (NUS).
Who Can Apply
Applicants should meet the following qualifications:
- Hold a Ph.D. in Electrical and Electronics Engineering, Computer Engineering, Applied Physics, or a closely related discipline.
- Have research experience in analytical modeling, equivalent-circuit development, or advanced interconnect technologies.
- Demonstrate knowledge of circuit theory, electromagnetics, transmission lines, and electrical performance evaluation.
- Have experience with compact models, parameterized model libraries, or electrical components of process design kits (PDKs).
- Possess relevant research publications.
- Demonstrate strong analytical, computational, communication, and collaborative research skills.
- Be willing to work under a fixed-term contract.
Main Requirements
1. Analytical and Equivalent-Circuit Modeling
- Develop physics-based analytical models and lumped or distributed equivalent circuits for advanced interconnects and power delivery structures.
- Establish relationships between interconnect geometry, material properties, operating conditions, and electrical parameters.
- Model resistance, inductance, capacitance, and conductance.
2. Electrical Performance Evaluation
- Quantify and benchmark latency, usable bandwidth, and energy per bit.
- Evaluate performance trade-offs across interconnect dimensions, integration architectures, and operating conditions.
- Account for driver, channel, and receiver contributions where relevant.
3. Signal Integrity Analysis
- Investigate insertion loss, return loss, impedance discontinuities, reflections, and crosstalk.
- Analyze eye-diagram degradation and high-speed electrical link performance.
- Develop design guidance for high-density electrical interconnects.
4. Power Integrity Analysis
- Analyze DC IR drop, transient voltage droop, power delivery impedance, and resonances.
- Evaluate power and ground interconnects, decoupling capacitance, and supply distribution architectures.
- Investigate voltage stability and power delivery performance.
5. PDK and Model Library Development
- Develop parameterized compact models and reusable interconnect libraries.
- Prepare model documentation for packaging and interconnect PDKs.
- Define model validity ranges and incorporate process, geometry, and temperature variations.
6. Model Extraction and Validation
- Extract electrical model parameters from electromagnetic simulations, test structures, and measurements.
- Validate analytical and equivalent-circuit models against simulation and experimental results.
- Quantify model accuracy and identify the operating conditions under which simplified models remain reliable.
7. Research and Collaboration
- Collaborate with fabrication, packaging, device, and circuit researchers.
- Connect fabrication process capabilities with electrical performance requirements.
- Publish research findings and contribute to technical reports and project milestones.
Technical Skills and Experience
Applicants should demonstrate expertise in relevant areas, including:
- Circuit Theory and Electromagnetics: Strong understanding of transmission lines, circuit fundamentals, and interconnect physics.
- Advanced Packaging Technologies: Knowledge of 3D integrated circuits, hybrid bonding, through-silicon vias (TSVs), redistribution layers, backside power delivery, or co-packaged optics.
- Electrical Modeling: Experience developing analytical models, equivalent circuits, compact models, and parameterized model libraries.
- Signal and Power Integrity: Understanding of high-speed interconnects, power delivery networks, latency, bandwidth, and energy consumption.
- Electromagnetic Parameter Extraction: Familiarity with frequency-dependent interconnect modeling and electromagnetic simulations.
- Electrical Measurements: Experience with S-parameter measurements, time-domain reflectometry, electrical test structures, or measurement de-embedding.
- Electro-Thermal Modeling: Understanding of temperature effects, device junction temperatures, and process variations affecting electrical performance.
- Programming and Simulation: Proficiency in Python or MATLAB for numerical analysis, model fitting, parameter extraction, sensitivity analysis, and automated design exploration.
- Circuit Simulation: Experience with SPICE-compatible simulators or equivalent computational tools.
- Research Communication: Ability to prepare research publications, present technical findings, and communicate complex concepts to multidisciplinary audiences.
Important Notes
- The position is a postdoctoral Research Fellow appointment within the NUS Department of Electrical and Computer Engineering.
- The successful candidate will report to Prof. Yu Chen-Hua.
- The research focuses on electrical modeling and performance evaluation of advanced packaging and high-density interconnect technologies.
- The role combines analytical modeling, circuit simulation, experimental validation, and reusable model development for PDKs.
- Expertise in a specific commercial electronic design automation (EDA) platform is not essential.
- Applicants must be open to a fixed-term contract.